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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)

Original price was: $189.00.Current price is: $19.99.

Essential guide on 3D microelectronic packaging: fundamentals, architecture, applications, and quality. Dive into TSV, micro-bumps, bonding, and failure analysis

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Description

This book offers a comprehensive reference guide for graduate students and professionals in academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers with an in-depth understanding of the latest research and development findings regarding this crucial industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure. They will also be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.